Substrate processing device having connection plates, substrate processing method

ABSTRACT

Examples of a substrate processing device include an annular distribution ring, a plurality of connection plates continued to the distribution ring and having non-uniform impedances, a shower plate electrically connected to the plurality of connection plates, and a stage provided below the shower plate so as to face the shower plate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 62/912,620, filed on Oct. 8, 2019, in the United States Patent and Trademark Office, the disclosure of which is incorporated herein in its entirety by reference.

TECHNICAL FIELD

Examples are described which relate to a substrate processing device and a substrate processing method.

BACKGROUND

Gas supplied between a shower plate and a stage may be sometimes plasmatized by supplying a high frequency power to the shower plate at multiple points. A bias or lack of uniformity may occur in the plasma generated in this manner. That is, the plasma density may become higher at some locations and lower at other locations.

SUMMARY

Some examples described herein may address the above-described problems. Some examples described herein may provide a device and method that can control the distribution of plasma density in a simple manner.

In some examples, a substrate processing device includes an annular distribution ring, a plurality of connection plates continued to the distribution ring and having non-uniform impedances, a shower plate electrically connected to the plurality of connection plates, and a stage provided below the shower plate and facing the shower plate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional perspective view of a substrate processing device;

FIG. 2 is a perspective view of the distribution ring and the connection plates;

FIG. 3 is a cross-sectional view of a substrate processing device according to another example;

FIG. 4 shows a connection plate having a coil;

FIG. 5 shows a connection plate having a coil;

FIG. 6 shows a connection plate having a coil;

FIG. 7 shows a relationship between the number of turns of the coil and the inductance;

FIG. 8 shows a device used in an experiment;

FIG. 9 shows an experimental results;

FIG. 10 shows the retractable impedance adjuster;

FIG. 11 shows another example of the retractable impedance adjuster;

FIG. 12 is a cross-sectional view of a substrate processing device according to another example;

FIG. 13 is a partial plan view of the substrate processing device of FIG. 12, and

FIG. 14 shows a variation in plasma distribution relative to change in capacity of the capacitive element.

DETAILED DESCRIPTION

A substrate processing device and a substrate processing method will be described with reference to the drawings. The same or corresponding components may be denoted by the same reference numerals and duplicate description thereof may be omitted.

FIG. 1 is a cross-sectional perspective view showing an example of a configuration of a substrate processing device. This substrate processing device has a parallel plate structure including a stage 10 and a shower plate. The shower plate includes a lower shower plate 14 facing the stage 10 and an upper shower plate 16 provided on the lower shower plate 14. The lower shower plate 14 is provided with slits such that gas supplied to a space between the lower shower plate 14 and the upper shower plate 16 is supplied between the lower shower plate 14 and the stage 10. The lower shower plate 14 is mounted, for example, on an exhaust duct 12 via, for example, an 0 ring. According to another example, the lower shower plate 14 and the upper shower plate 16 may be integrated into one component.

A relay ring 18 is placed on the upper shower plate 16 and the lower shower plate 14. The relay ring 18 and the shower plate may be made of metal. The exhaust duct 12 may be made of ceramic. A specific example of the ceramic is alumina. FIG. 1 shows a distribution ring 20 and connection plates 22, 24 used for supplying a high frequency power to the lower shower plate 14 at multiple points.

FIG. 2 is a perspective view showing the distribution ring 20 and the connection plates 22, 24, 26, 28. The distribution ring 20 is an annular conductive material. The plurality of connection plates 22, 24, 26, 28 are formed of a conductive material continued to the distribution ring 20. The material of the distribution ring 20 and the connection plates 22, 24, 26, 28 is aluminum, for example. The number of connection plates may be any number that is two or more. A projection 20 a is provided on an upper surface of the distribution ring 20. The high frequency power may be supplied to the projection 20 a. According to an example, the high frequency power supplied to the projection 20 a from a high frequency power application device 20 b has a frequency of 27.12 MHz or more.

The connection plates 22, 24, 28 each have a folded plate shape. A connection plate 26 includes a coil 26A and plate-like end portions 26B, 26C provided at both ends of the coil 26A. A part of the connection plate 26 is provided with the coil 26A so as to provide inductance to a high frequency power path. As a result, the plurality of connection plates 22, 24, 26, 28 have non-uniform impedances. The number of connection plates having the coils may be any number that is two or more. At least one of the plurality of connection plates has the coil having one end electrically connected to the distribution ring 20 and the other end electrically connected to the lower shower plate 14.

FIG. 1 shows that the connection plates 22, 24 are electrically connected to a part of the lower shower plate 14 via the relay ring 18. In this example, all the connection plates 22, 24, 26, 28 are in contact with the lower shower plate 14 via the relay ring 18. For example, it may be configured that through holes extending through respective connection plates, the relay ring 18, and the lower shower plate 14 are formed, and they are then screwed together using this through hole.

FIG. 3 is a cross-sectional view of a substrate processing device according to another example. A chamber 30 covering the lower shower plate 14 and the stage 10 is illustrated in FIG. 3. In this example, the connection plates and the lower shower plate 14 are in direct or indirect contact with each other. The means for fixing the connection plates to the lower shower plate 14 is screwing, for example, as similar to the above description. In both of the example of FIG. 1 and the example of FIG. 3, the high frequency power application device 20 b is connected to the projection 20 a in contact with the distribution ring 20.

FIGS. 4 to 6 are views showing an example of the configuration of the connection plate 26. FIGS. 4 to 6 show the coils 26A whose number of turns is different. FIG. 4 shows an equation for calculating inductance provided by the connection plate 26. By changing the shape of the coil, inductance of different values can be provided to the high frequency power path. In FIGS. 4 to 6, end portions 26B, 26C may need to be shaped so as to achieve necessary connection. FIG. 7 is a drawing showing a relationship between the number of turns of the coil and the inductance. As the number of turns of the coil becomes greater, the inductance becomes greater.

Next, an example of the substrate processing method using the above-described substrate processing device will be described. First, a substrate to be treated by plasma is placed on the stage 10. Then, a high frequency power is applied to the lower shower plate 14 while gas is supplied between the shower plate and the stage 10 from the shower plate. The high frequency power is supplied to the lower shower plate 14 from the high frequency power application device 20 b through the distribution ring 20 and the plurality of connection plates 22, 24, 26, 28 having non-uniform impedances. Thereby, plasma is generated between the lower shower plate 14 and the stage 10. As the coil is provided to at least one of the plurality of connection plates 22, 24, 26, 28 so as to make the connection plates have non-uniform impedances, it is possible to control the in-plane distribution of plasma density.

The plasma treatment on the substrate may include film formation, etching, or film modification, for example. According to one example, the above-described non-uniform impedances make the plasma density uniform in the plasma generation space. Thus, in one example, it is possible to make the film having substantially uniform thickness.

FIGS. 8 and 9 are drawings showing the configuration of a device used in an experiment and experimental results. FIG. 8 shows a pass-through 30A formed in the chamber 30. The pass-through 30A is a hole through which a substrate is inserted into and removed from the chamber 30. For example, when connection plates having a uniform impedance are used, the plasma density tends to be higher nearer the pass-through 30A, and lower farther from the pass-through 30A. A column “POR” in FIG. 9 shows experimental results in the case of using connection plates having a uniform impedance. “Range” indicates a difference between a maximum film thickness and a minimum film thickness in a substrate of interest. “1 sigma” represents a standard deviation. From a map in the column “POR”, it can be understood that the plasma density is higher at a location nearer the pass-through 30A, which is located in upper left side of this map, and lower at a location farther from the pass-through 30A.

A column “3.5 coil” in FIG. 9 shows experimental results in the case of using the coil of FIG. 5 as the coil 26A. A column “5.5 coil” of FIG. 9 shows experimental results in the case of using the coil of FIG. 6 as the coil 26A. In both experiments, pass-through 30A is located in upper left side and coil 26A is placed in the connection plate most distant from the pass-through 30A. These results indicate that providing the coil to the connection plate 26, which is a connection plate most distant from the pass-through 30A among the plurality of connection plates, promotes enhancement of the plasma uniformity. For example, by using the coil, the plasma density at a location on the stage 10 nearer the pass-through 30A can be equal to or lower than the plasma density at a location on the stage 10 farther from the pass-through 30A. In some examples, the connection plates have at least one coil placed far from the pass-through 30A.

FIG. 10 is a perspective view showing an example of the configuration of the connection plate according to another example. In this example, a retractable impedance adjuster 50 is provided. The retractable impedance adjuster 50 includes a magnetic bar 51, a support block 52, and a micro gauge 54. By rotating the micro gauge 54, the insertion amount of the magnetic bar 51 into the coil 26A can be adjusted. Specifically, the magnetic bar 51 is movable in arrow directions in FIG. 10. Since the insertion amount is displayed on the micro gauge 54, an operator can easily realize an insertion amount required for obtaining a desired impedance. In this manner, the retractable impedance adjuster 50 is configured to insert or remove the magnetic bar 51 into or from the coil 26A.

FIG. 11 is a view showing a modification of the retractable impedance adjuster. The retractable impedance adjustor 55 includes a magnetic bar 51, an accommodating section 56 for accommodating a part of the magnetic bar 51, and a set screw 57. The set screw 57 is inserted into a screw hole of the accommodating section 56, so that the magnetic bar 51 can be pressed and fixed to the accommodating section 56. In addition to the examples of FIGS. 10, 11, there may be adopted retractable impedance adjusters of various types, which can adjust the insertion amount of the magnetic bar 51 into the coil 26A. The adjustment of the insertion amount causes change in magnetic flux, to thereby carry out the adjustment of the inductance. An inductance L is given by Nϕ/I. “N” represents the number of turns of a coil, ϕ represents a magnetic flux [wb], and I represents current [A].

According to another example, each of the plurality of connection plates may be provided with a coil, and above-described retractable impedance adjuster may be provided to all connection plates. With this configuration, it is possible to facilitate precise adjustment of impedance non-uniformity. According to yet another example, providing at least two connection plates with the coils and the retractable impedance adjustors allows the adjustment of impedance non-uniformity.

FIG. 12 is a cross-sectional view of a substrate processing device according to another example. A connection plate 60 is shown as one of a plurality of connection plates continued to a distribution ring 20. In this example, a screw hole is formed in the distribution ring 20 and the connection plate 60, and a screw 61 is fastened into the screw hole so as to fix both of them. According to an example, the connection plate 60 includes a metal portion 60 a, a capacitive element 60 b, a first thermal insulating member 60 c, and a metal portion 60 d. The respective components, which are the metal portion 60 a, the capacitive element 60 b, the first thermal insulating member 60 c, and the metal portion 60 d, can be fixed with a conductive adhesive, solder or screw fastening, for example. One electrode of the capacitive element 60 b is in contact with the metal portion 60 a, and the other electrode thereof is in contact with the first thermal insulating member 60 c. The capacitive element 60 b is a ceramic capacitor, for example.

The above-described screw hole is formed in the metal portion 60 a. The material of the metal portions 60 a, 60 d is aluminum, for example. The material of the first thermal insulating member 60 c can be any material having a lower thermal conductivity than that of the lower shower plate 14. According to an example, the lower shower plate 14 is formed of aluminum, and the first thermal insulating member 60 c includes at least one of Ni, Co, and Ti. Such a first thermal insulating member 60 c can be provided between the capacitive element 60 b and the lower shower plate 14, in the high frequency power path.

The upper surface of the lower shower plate 14 is provided with an annular groove. A second thermal insulating member 70 is provided in this groove. The second thermal insulating member 70 has an annular shape fitted in this groove in a plan view, and is formed of a material having a thermal conductivity lower than that of the lower shower plate 14. According to an example, the lower shower plate 14 is formed of aluminum, and the second thermal insulating member 70 includes at least one of Ni, Co, and Ti.

FIG. 13 is a partial plan view of the substrate processing device of FIG. 12. The second thermal insulating member 70 is provided in an annular shape along a part near the outer edge of the lower shower plate 14. All the connection plates 22, 24, 28, 60 are in contact with the second thermal insulating member 70. In other words, all the connection plates 22, 24, 28, 60 are electrically connected to the lower shower plate 14 through the second thermal insulating member 70. Thus, one end of the capacitive element 60 b is electrically connected to the distribution ring 20 and the other end thereof is electrically connected to the lower shower plate 14. By rotating a member having the distribution ring 20 and the connection plates 22, 24, 28, 60 with respect to the second thermal insulating member 70, a contact position between the connection plates 22, 24, 28, 60 and the second thermal insulating member 70 can be easily changed. This change is carried out for changing a feeding position to the lower shower plate 14, and thus this change enables adjustment of the plasma distribution. Screw 62 may be used to securely connect the connection plate with the second thermal insulating member 70. In case where the screw 62 is used, many screw holes such as multiple of 4 should be tapped in the second thermal insulating member 70 so as to rotate the connection plates with respect to the second thermal insulating member 70.

FIG. 12 shows a shower plate heater 14A. The shower plate heater 14A is provided in order to heat the lower shower plate 14. In the example of FIG. 12, the shower plate heater 14A is provided at an outer edge portion of the lower shower plate 14. FIG. 13 shows a case of providing two shower plate heaters 14A. The first thermal insulating member 60 c and the second thermal insulating member 70 prevent the capacitive element 60 b from having an excessively high temperature due to the lower shower plate 14 heated by the shower plate heater 14A. Accordingly, the capacitive element 60 b is maintained at a temperature of less than 125° C., for example.

In this example, the first thermal insulating member 60 c and the second thermal insulating member 70 are provided in order to prevent the capacitive element 60 b from being damaged due to a high temperature. According to another example, any one of the first thermal insulating member 60 c and the second thermal insulating member 70 can be omitted. According to yet another example, any cooling means, such as an air blower or coolant providing device, can be used to cool the capacitive element 60 b.

In this manner in the substrate processing device shown in FIGS. 12, 13, at least one of the plurality of connection plates is provided with the capacitive element 60 b. Providing the capacitive element causes non-uniform impedances to the plurality of connection plates. Supply of a high frequency power to the lower shower plate 14 through non-uniform impedances allows correction of a plasma uniformity resulting from the device configuration, for example.

FIG. 14 is a view showing variation in plasma distribution relative to change in capacity of the capacitive element provided to the connection plate. FIG. 14 shows results obtained through a simulation in which high frequency power of 27.12 MHz is supplied to multiple points. In eight distributions of the plasma density shown in FIG. 14, a pass-through 30A, in which a wafer is inserted and removed, is provided at an upper left portion. In eight examples disclosed herein, substrate processing devices are each provided with four connection plates. A connection plate located farthest from the pass-through 30A is provided with a capacitive element. In this case, the sheath capacitance of an inner wall of the pass-through 30A increases, so that the plasma density tends to increase near the pass-through 30A. Therefore, in an actual film formation, the film thickness on the pass-through side tends to be thicker, which makes it difficult to improve in-plane uniformity. For example, it is understood that when the capacity of the capacitive element is 213 pF, 425 pF, or 637 pF, a high plasma density is likely to be generated near the pass-through 30A. However, within a range from 1062 to 2125 pF, it is possible to increase the plasma density located farthest from pass-through 30A. In the example of FIG. 14, a generally uniform distribution of the plasma density can be obtained with a capacity of 2125 pF or more.

At least one of the plurality of connection plates can be configured as the connection plate 60. According to another example, the configuration of the connection plate 60 is applied to all the connection plates so as to make the capacities of the capacitive elements non-uniform, which facilitates adjustment of the plasma density. According to another example, the configuration of the connection plate 60 is applied to at least two connection plates so as to make the capacities of the capacitive elements non-uniform, which facilitates adjustment of the plasma density. 

1. A substrate processing device comprising: an annular distribution ring; a plurality of connection plates continued to the distribution ring and having non-uniform impedances; a shower plate electrically connected to the plurality of connection plates; and a stage provided below the shower plate and facing the shower plate.
 2. The substrate processing device according to claim 1, wherein at least one of the plurality of connection plates has a coil having one end electrically connected to the distribution ring and the other end electrically connected to the shower plate.
 3. The substrate processing device according to claim 2, further comprising a chamber surrounding the shower plate and the stage, the chamber is provided with a pass-through allowing the substrate to be inserted and removed therethrough, wherein the plurality of connection plates comprise at least one coil including the coil, the at least one coil is placed far from the pass-through.
 4. The substrate processing device according to claim 2, further comprising a retractable impedance adjuster configured such that a magnetic bar is inserted into and removed from the coil.
 5. The substrate processing device according to claim 4, wherein all of the plurality of connection plates have the coils, and the retractable impedance adjuster is provided to each of the coils.
 6. The substrate processing device according to claim 4, wherein the retractable impedance adjustor has a micro gauge that is configured to indicate an amount of insertion of the magnetic bar into the coil.
 7. The substrate processing device according to claim 4, wherein the retractable impedance adjuster includes an accommodating section that accommodates a part of the magnetic bar; and a set screw that is inserted into a screw hole of the accommodating section so as to press and fix the magnetic bar to the accommodating section.
 8. The substrate processing device according to claim 1, wherein at least one of the plurality of connection plates has a capacitive element having one end electrically connected to the distribution ring and the other end electrically connected to the shower plate.
 9. The substrate processing device according to claim 8, wherein the capacitive element is a ceramic capacitor.
 10. The substrate processing device according to claim 8, wherein the connection plate having the capacitive element includes a first thermal insulating member having a thermal conductivity lower than thermal conductivity of the shower plate, between the capacitive element and the shower plate.
 11. The substrate processing device according to claim 10, wherein the first thermal insulating member contains at least one of Ni, Co, and Ti.
 12. The substrate processing device according to claim 8, further comprising a second thermal insulating member having an annular shape fitted in an annular groove on an upper surface of the shower plate and formed by a material having a thermal conductivity lower than that of the shower plate, wherein the connection plate having the capacitive element is in contact with the shower plate via the second thermal insulating member.
 13. The substrate processing device according to claim 12, wherein the second thermal insulating member includes at least one of Ni, Co, and Ti.
 14. The substrate processing device according to claim 1, further comprising a high frequency power application device connected to the distribution ring.
 15. The substrate processing device according to claim 1, further comprising a shower plate heater configured to heat the shower plate.
 16. A substrate processing method comprising: placing a substrate on a stage; and generating plasma between a shower plate and the stage by applying a high frequency power to the shower plate while providing gas between the shower plate and the stage from the shower plate facing the stage, wherein the high frequency power is supplied to the shower plate through a plurality of connection plates having non-uniform impedances.
 17. The substrate processing method according to claim 16, wherein the high frequency power has a frequency of 27.12 MHz or more.
 18. The substrate processing method according to claim 16, wherein a chamber covering the shower plate and the stage is formed with a pass-through configured to insert and remove the substrate; and a plasma density at a location on the stage nearer the pass-through is equal to or lower than a plasma density at a location on the stage farther from the pass-through. 